12th
IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in
Electronic Systems
(ITherm2010)
Bally's
Las Vegas, NV, USA
02 Jun - 05 Jun 2010
Conference Scope:
Original papers are solicited in the general areas of (but not
limited to):
Thermal Management: • Novel Materials: Thermal Vias, Heat Spreaders and Thermal Interface
Materials
• Natural and Forced Convection Air Cooling
• Advances in Compact Air Movers
• Single Phase Liquid Cooling
• Novel Phase Change Cooling Techniques: Boiling, Heat Pipes,
Thermosyphon, Spray and Jet Impingement
• Microfabricated Thermal Management Devices and Systems
• Sub-Ambient Cooling: Solid State, Vapor Compression, Absorption,
Adsorption, Thermo-acoustic, Magnetocaloric
• Thermal Management in Wireless, Networking, Computing, Lighting, Harsh
Environments, and Peripheral Hardware.
• Thermal and Energy Management in Data Centers
• Three-Dimensional Electronics
• Advances in Experimental Characterization
• Advances in Computational Characterization: Multi-Scale Modeling,
Compact Modeling, Multi-Physics Modeling, Multi-Objective Design
and Optimization
Mechanics:
• Modeling and Simulation for Reliability at Package, Board, and System
Levels
• Failure Mechanics and Damage Modeling
• Experimental Techniques
• Constitutive Models
• Impact, Drop and Vibrational Analysis of Packages, Sub-Systems, and
Systems
• Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
• Materials
Design, Synthesis, and Processing of Materials for Thermal/Thermo-Mechanical
Management in Electronic Systems- -
- Thermo-mechanical Characterization and Modeling of
Packaging Materials-
- Material Interfaces: Engineering, Characterization and
Simulation-
Emerging Technologies: • Sensors (Medical, Military, Consumer, Structures, Diagnostic, etc.)
• Nanotechnology: Thermal, Mechanics, Material and Process Related Issues
in Nanostructures
• Micro-Fluidics
• Fiber-Optics Interconnect Systems & Free Space Optical Interconnects
• MEMS: Device and Package Level Reliability Issues
• Integrated Biochips and Bioelectronics
• Medical, Telecommunication, and Automotive Systems
• Space Systems: Earth Orbiting and Deep-Space Missions
Important Dates:
Deadline for submission of Abstracts - August 31, 2009 September
30, 2009
Notification of Abstract Acceptance - September 28, 2009 October
15,2009
Draft Paper Submission - December 14, 2009
Final Paper Submission - March 7, 2010
ITherm 2010 - June 2-5, 2010
