IEEE Workshop on Microelectronics and Electron Devices (WMED2010)

Boise State University, Student Union Building
Boise, ID, USA

Friday, April 16, 2010

Conference Scope:

Microelectronic Device Processing and Process Integration

Trends in submicron technologies; product development (DRAM, SRAM, Flash, CMOS Imagers); new device technologies (Phase Change Memory, Resistive Memory, Ferroelectric Memory, Nano-electronics), novel transistors, device improvements.

Microelectronic Device Electrical and Reliability Testing

Dielectric reliability; device reliability; phase change memory reliability; novel memory technology testing schemes; electrical properties of novel devices.

Semiconductor Packaging and Reliability

Semiconductor package reliability, Design for Manufacturability, and stacked die packaging, and novel assembly processes. Novel packaging structures, processes, and materials.

Microelectromechanical Systems (MEMS) and Nanoelectronic Devices

Novel processes and materials, MEMS research, development and performance; nanotubes, nanowires, quantum dots, molecular devices, device characterization for nanoelectronic devices.

Microelectronic Circuit Design

New product design, design techniques, and memory sensing schemes.

Important Dates:

http://www.ewh.ieee.org/r6/boise/wmed2010/WMED2010.html

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