18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEP2009)

Portland (Tigard), Oregon

October 19-21, 2009

Conference Scope:

• Current and future issues related to signal interconnections including on-chip and system interconnect structures.
• Signal integrity of interconnections.
• Power integrity of electronic components and systems.
• Design and measurement of high speed links, including jitter and noise management and characterization.
• Innovative interconnect packaging structures and their electrical performance.
• Measurement and data analysis techniques for system level and on-chip structures.
• Signal and power integrity in mixed signal and RF circuits and modules.
• RF/microwave packaging structures and their electrical performance.
• Electromagnetic modeling and simulation algorithms, tools and design flows.
• Macromodeling and model reduction as it applies to electrical analysis.
• Advances in transmission-line analysis techniques.

Important Dates:

Paper Submission: July 18, 2009

http://epeps.ece.illinois.edu/index.html

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