International
Conference on Power System Technology
(POWERCON2010)
Hangzhou, Zhejiang Province, China
Hangzhou, China
24 Oct - 28 Oct, 2010
Conference Scope:
distributed generation, renewables generation and
its integration into power systems, UHV transmission, wide area
interconnections, development of smart grid, energy storage, energy saving and
emission reduction.
Important Dates:
-Deadline of Abstract Submission:March 1, 2010
-Notification of Abstract Acceptance:April 15, 2010
-Deadline of Full Paper Submission:June 15, 2010
-Notification of Full Paper Acceptance:August 1, 2010
-Deadline of Registration for Paper Publication and Early Bird
Registration:September 1, 2010
RENEWABLE AND
ALTERNATIVE ENERGY SYSTEMS
Solar and photovoltaic energy systems and interface, wind energy systems
and interface, water energy systems and interface, energy harvesting, fuel
cells and conversion, solid state generation and interface (e.g.
thermoelectric, thermophotovoltiac, thermionic), and energy storage and
interface (e.g. battery, flywheel, SMES, thermal).
CONTROL ISSUES
Power converter and motor control algorithms, real-time control
implementation, digital control techniques, sensors and sensor elimination
techniques for power electronics, machines and drives, and measurements
and instrumentation.
THERMAL MANAGEMENT
AND EFFICIENCY
Thermal managementf of electrical machines, power converters, and drives;
energy efficiency
of power electronics, electric machines, and drive systems.
ELECTRICAL POWER
SYSTEMS
Electrical power system architectures and management, distributed
resources and microgrid power systems.
POWER QUALITY,
GRID INTERFACE, AND EMI
EMI-EMC, power quality including harmonics and active filters, and power
factor correction.
RELIABILITY AND
DIAGNOSTICS
Reliability, fault management, protectin and fault tolerance; power
converter and machine diagnostics and prognostics.
MODELING,
ANALYSIS, AND SIMULATION
Modeling, analysis and simulation methods for power electronics and motor
drives, optimization techniques for electric machines and power
electronics.
OTHER
TOPICS
Education methodology and tools for power electronics, electric machines,
and drives, development and harmonization of standards for electric
machines, power converters, and drives.
Components,
Subsystems, and Applications
POWER
CONVERTERS
DC-DC; DC-AC; AC-AC; AC-DC; soft switching and resonant converters;
inverters and converters for motor drives, and multilevel converters.
ELECTRIC MACHINES
AND ACTUATORS
Permanent magnet machines, induction machines, reluctance machines, linear
electric machines, electromechanical energy storage systems (flywheels),
special machines, actuators and transducers, new materials utilization in
electric machines and actuators.
ELECTRIC DRIVES
Drive configurations for all types of electric machines and actuators; all
issues related to the performance, control, reliability, and cost of
electric drives; drives of all performance levels ranging from
general-purpose to high-performance servos; system interactions between
drives, machines, and sources; machine drive integration issues.
APPLICATIONS
Transportation applications for automotive, rail, aerospace, and marine,
including hybrid-electric drivetrains and accessories; lighting and
displays; uninterruptible power supply (UPS) industrial, residential, and
commercial systems; utility applications in transmission and distribution
including HVDC; biomedical applications; other applications of power
electronics, electric machines, and drives.
International
Conference on Signals and Electronic Systems
(ICSES2010)
Conference nad Congress Center of Silesian
University of Tec
GLIWICE, Poland
07 Sep - 10 Sep, 2010
Conference Scope:
Signals: Analog
and digital signals processing; Speech and biomedical signal processing
and coding; Multirate signal processing; A/C and C/A Conversion.
Images: Image
processing; Image formation, modeling and representation; Image analysis
and pattern recognition; Image/video coding and transmission; Image
storage, retrieval; Multimedia.
Circuits: General
circuits theory; Methods of circuit analysis, synthesis, design, and
optimization; Analog and digital filter design; ASICs and VLSI circuit
design; Nonlinear and chaotic circuits;Switched-capacitor and
switched-current circuits; Neural networks; Cellular neural networks; RF
and microwave circuits.
Systems: Analog
and digital electronic systems; Electronic embedded systems; VLSI and
large scale systems; Data Acquisition Systems, FPGA-based systems;
Multimedia systems; RF systems, Communication systems; Nonlinear,
adaptive, and intelligent systems; Neural and fuzzy systems; Artificial
intelligence and expert systems
Mathematical
and Computational Methods: Fast algorithms and transforms;
Simulation and modeling; Testing and fault analysis; Sensitivity and
symbolic analysis; Multiresolution analysis and wavelets; Neural and fuzzy
computing; Computer aided design.
Applications: Electronic
systems, signals and image processing and recognizing in medicine,
environment, communications etc.
Education: Multimedia
in education; Software for teaching signals and electronic systems;
Student laboratories.
Important Dates:
May
7, 2010 Deadline for paper submission
June
30, 2010 Notification of acceptance
July
23, 2010 Deadline for reduced registration fee
IEEE
Region 8 International Conference on "Computational Technologies in
Electrical and Electronics Engineering"
(SIBIRCON2010)
Baikal Business Center
Irkutsk, Russia
11 Jul - 15 Jul 2010
Conference Scope:
Previously
unpublished contributions from a broad range of topics in the scope of the IEEE
are solicited, including (but not limited to) the following areas:
information
theory
cryptography
and data security
education
and e-learning
telecommunications
wireless communications
microwave
theory and techniques
development
and control of energy systems
power
electronics
energy
conversion and renewable energy
industry
applications
Important Dates:
Submission of papers (up to 6 pages): March 1,
2010
Paper acceptance
notification: April
26, 2010
Camera-ready papers and registration: May 24, 2010
International
Conference on Nuclear Energy and Engineering Technology
(NEET2010)
Sophia International Hotel
Qingdao, China
28 Aug - 31 Aug, 2010
Conference Scope:
Original papers
describing current research in the following themes are invited in, but not
limited to the following areas.
Nuclear energy
applications
Nuclear Reactor
Technology
Education & training
in nuclear energy research
Policy studies &
issues
Water, Hydrogen and
energy storage
Nuclear radiation and
shielding
Nuclear physics
Nuclear power in
developing countries
Nuclear power in
developed countries
Future Engineering
technologies for nuclear energy applications Such as(Power,Grid, Wireless
Communication, Computer, Control and so on )
Important Dates:
Paper submission due: March 10, 2010 Acceptance notification: April 15, 2010 Camera-ready due: May 15, 2010 Author registration:May 15, 2010 Conference: August 28-31, 2010
- Circuit design to address challenges of deeply scaled technologies - e.g. DFM, variability, reliability
- Digital circuit techniques
- Analog and mixed signal circuits such as data converters and amplifiers to address performance, power, technology scaling, and variability
- Complex SOC systems describing new architectures and implementations
- Circuit approaches for clock generation and distribution
- Advances in memory circuits; especially for embedded memories in scaled technologies
- Adaptive power techniques and power management for analog and digital circuits
- Techniques for digitally-assisted analog and analog-assisted digital including digital implementation of previously analog functions
- RF and wireless communications with emphasis on system architecture and implementation
- Circuits for sensors and displays
- Wireline transceiver and I/O design optimized for high bandwidth and low-power spanning from chip-to-chip through long-reach applications
- Fundamentals related to the above, including innovative transistor-level circuit design and circuits for characterizing technology changes and variations
Important Dates:
Paper Submission Deadline 5:00 p.m., January 25, 2010 (PST)
Control and Systems: Adaptive and
intelligent control, Hybrid control, Digital control theory and development,
Robust control, Nonlinear systems and control, Process control, networked
control, cooperative control, bio-control
Energy and Environment: Energy
management and control systems, Energy distribution, storage and recovery,
Alternative and green energy, Waste management, Waste treatment and recycling,
Water network and security, Sensor technologies, Intelligent Micro-grids
Mechatronics: Robotics, Sensors and
actuators, Sensor fusion, High precision motion control, Micro
electromechanical systems, industrial automation, Remote operation
Power Electronics: Power devices and
components, Power quality control, FACTS, PFC,STATCOM, Harmonic analysis and
compensations, Switching circuits and power converters, Motors and drives
Signal Processing:Image processing,
Computer vision, Bio-image processing, Audio/video processing, Data processing,
Estimation and identification, Remote sensing
Network and Communication Technologies:Network
protocols, Mobile computing, Mobile ad hoc networks, Mobile agents, Network
architectures, Quality of services, Cross-layer design/optimisation, Design and
performance evaluation, Traffic control, Wireless systems
Important Dates:
Deadline for Full Paper submission: 1 October 2009 Deadline for Invited
and Special Sessions: 1 December 2009 Notification of Acceptance: 31 January
2010 Deadline for Camera Ready Manuscript Submission: 15 March 2010 Deadline
for Authors’ Registration: 15 April 2010
International School on Nonsinusoidal Currents and Compensation 2010
(ISNCC2010)
Spa Morena Center
Lagow, Poland
15 Jun - 18 Jun, 2010
Conference Scope:
Systems with nonsinusoidal voltages and currents (NSV&C)
shall be the focus area of the conference and in particular, power properties
of such systems, identification, compensation, modeling, instrumentation, power
electronics, supply and loading qualities, as well as energy accounts in
systems with NSV&C, discussed from perspective of smart grid concept.
Important Dates:
February 28, 2010
submission of four-page paper outline
April 15, 2010
final confirmation of accepted paper
May 05, 2010
final date for confirmation of participation and sending fees
The Design Automation Conference (DAC) is the
premier event for the design of electronic circuits and systems, and for EDA
and silicon solutions. DAC features a wide array of technical presentations
plus over 200 of the leading electronics design suppliers.
Important Dates:
Panels, Speaker's Bureau, Tutorials and Special Sessions
OPENS: Oct. 1, 2009 CLOSES: Oct. 26, 2009 Research and WACI Papers
OPENS: Oct. 19, 2009 CLOSES: Nov. 19, 2009 User Track Slides
OPENS: Oct. 19, 2009 CLOSES: Nov. 9, 2009 Workshops and Colocated Events
OPENS: Oct. 19, 2009 CLOSES: Jan. 29, 2010
12th
IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in
Electronic Systems
(ITherm2010)
Bally's
Las Vegas, NV, USA
02 Jun - 05 Jun 2010
Conference Scope:
Original papers are solicited in the general areas of (but not
limited to):
Thermal Management: • Novel Materials: Thermal Vias, Heat Spreaders and Thermal Interface
Materials
• Natural and Forced Convection Air Cooling
• Advances in Compact Air Movers
• Single Phase Liquid Cooling
• Novel Phase Change Cooling Techniques: Boiling, Heat Pipes,
Thermosyphon, Spray and Jet Impingement
• Microfabricated Thermal Management Devices and Systems
• Sub-Ambient Cooling: Solid State, Vapor Compression, Absorption,
Adsorption, Thermo-acoustic, Magnetocaloric
• Thermal Management in Wireless, Networking, Computing, Lighting, Harsh
Environments, and Peripheral Hardware.
• Thermal and Energy Management in Data Centers
• Three-Dimensional Electronics
• Advances in Experimental Characterization
• Advances in Computational Characterization: Multi-Scale Modeling,
Compact Modeling, Multi-Physics Modeling, Multi-Objective Design
and Optimization
Mechanics:
• Modeling and Simulation for Reliability at Package, Board, and System
Levels
• Failure Mechanics and Damage Modeling
• Experimental Techniques
• Constitutive Models
• Impact, Drop and Vibrational Analysis of Packages, Sub-Systems, and
Systems
• Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
• Materials
Design, Synthesis, and Processing of Materials for Thermal/Thermo-Mechanical
Management in Electronic Systems- -
- Thermo-mechanical Characterization and Modeling of
Packaging Materials-
- Material Interfaces: Engineering, Characterization and
Simulation-
Emerging Technologies: • Sensors (Medical, Military, Consumer, Structures, Diagnostic, etc.)
• Nanotechnology: Thermal, Mechanics, Material and Process Related Issues
in Nanostructures
• Micro-Fluidics
• Fiber-Optics Interconnect Systems & Free Space Optical Interconnects
• MEMS: Device and Package Level Reliability Issues
• Integrated Biochips and Bioelectronics
• Medical, Telecommunication, and Automotive Systems
• Space Systems: Earth Orbiting and Deep-Space Missions
Important Dates:
Deadline for submission of Abstracts - August 31, 2009 September
30, 2009
Notification of Abstract Acceptance - September 28, 2009 October
15,2009
Draft Paper Submission - December 14, 2009
Final Paper Submission - March 7, 2010
ITherm 2010 - June 2-5, 2010
IEEE 60th Electronic Components and Technology Conference
(ECTC2010)
TBD Las Vegas, NV, USA
01 Jun - 04 Jun 2010
Conference Scope:
ECTC is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
Important Dates:
August 15, 2009 | Abstract and PDC Submission Starts Online October 15, 2009 | Final Abstract Submission Date
The 2nd International Conference on Industrial Mechatronics and Automation
(ICIMA2010)
Wuhan, China
May 30-31, 2010
Conference Scope:
The topics of interest include, but not limited to the following: T-1 Intelligent mechatronics, robotics, biomimetics, automation, and control systems T-2 Elements, structures, mechanisms, and applications of micro and nano systems T-3 Teleoperation, telerobotics, haptics, and teleoperated semi-autonomous systems T-4 Sensor design, multi-sensor data fusion algorithms and wireless sensor networks T-5 Biomedical and rehabilitation engineering, prosthetics and artificial organs T-6 Control system modeling and simulation techniques and methodologies T-7 AI, intelligent control, neuro-control, fuzzy control and their applications T-8 Industrial automation, process control, manufacturing process and automation T-9 Industrial drives, power electronics devices and components, energy systems, power systems engineering
Important Dates:
Paper submission due: February 10, 2010 Acceptance notification: February 15, 2010 Camera-ready due:March 15, 2010 Author registration:March 15, 2010 Conference: May 30-31, 2010
Optimization of Electrical and Electronic Equipment (OPTIM2010)
Brasov, Romania
May 20-22, 2010
Conference Scope:
Electrotechnics A-01 Electric Circuits and Networks A-02 Electromagnetic Field; Electrostatic Processes A-03 Electromagnetic Compatibility; Electromagnetic... A-04 Magnetic Materials A-05 Passive Components and Materials A-06 Electromagnetic Processing of Materials; Elect... A-07 High Voltage Technique: Discharges, Insulation A-08 Electric Arc: Modelling, Simulation; Lightning A-09 Electrical Apparatus A-10 Industrial and Commercial Power Systems: Trans... A.11 Power Quality and Utility Applications A.12 Power System Protection, Earthing A-13 Rural Electric Power A-14 Lighting Applications
Applied Electronics D-01 Power Electronics Components and Devices D-02 DSP and Microcontrollers for Power Electronics... D-03 Electronic Circuits and Network Theory D-04 Circuits & Systems D-05 Microsystems D-06 Symbolic Approaches on Electronics D-07 Embedded Systems, Hardware & Software Co-Desig... D-08 Measurements and Data Acquisition D-09 Metrology D-10 Audio and Video Signal Processing D-11 Reliability of Electronic Devices
Semiconductor package reliability, Design for Manufacturability, and stacked die packaging, and novel assembly processes. Novel packaging structures, processes, and materials.
Microelectromechanical Systems (MEMS) and Nanoelectronic Devices
Novel processes and materials, MEMS research, development and performance; nanotubes, nanowires, quantum dots, molecular devices, device characterization for nanoelectronic devices.
Microelectronic Circuit Design
New product design, design techniques, and memory sensing schemes.
IEEE International Power Modulator and High Voltage Conference
(IPMHVC2010)
TBD Atlanta, GA, USA
23 May - 27 May 2010
Conference Scope:
The program for this international conference will include technical, scientific, and industrial advances in the fields of repetitive pulsed power, high voltage dielectrics and components, closing and opening switches, biological/medical and environmental applications, high power microwaves, electromagnetic launchers, and other related fields.
Important Dates:
Abstract Submission Begins
November 1, 2009
Conference Registration Begins
January 12, 2010
Abstract Submission Ends
January 15, 2010
Author Acceptance Notification (Authors requiring visas may request an earlier general acceptance notification)
March 12, 2010
Conference Program Listed on Website
March 12, 2010
Student Travel Grants Application Packets Due
March 19, 2010
Professional Awards Nomination Packets Due
March 19, 2010
Early Conference Registration at Reduced Rate
April 18, 2010
Conference Hotel Reservation
April 22, 2010
On-Line Submission of Conference Proceedings Paper
IEEE International Conference on Industrial Technology (ICIT2010)
Viña del MarConferenceCenter Viña del Mar, Chile
March 14-17, 2010
Conference Scope:
Control Systems, Sensors, Instrumentation and Signal Processing, Electrical Machines and Drives, Mechatronics and Robotics, Power Electronics, Power Systems and Renewable Energy, System Integration, Industrial Informatics and, Communications, Hybrid/Electric Vehicle.
Important Dates:
Deadline for initial manuscript:2 October 2009
Notification of acceptance: 15 November 2009
Deadline for final manuscript: 15 December 2009
Special sessions:
Deadline for special sessions proposal: 15 July 2009
Notification of acceptance: 30 July 2009
Deadline for special session manuscripts: 9 October 2009
IEEE INTERNATIONAL CONFERENCE on ELECTRO/INFORMATION TECHNOLOGY
(EIT2010)
IllinoisStateUniversity Normal, IL, USA
May 20-22, 2010
Conference Scope:
Themes and topics of interest include but are not limited to:
Micro Electromechanical Systems & Mechatronics
Power Electronics
SolidState, Consumer and Automotive Electronics
Nanotechnology
Biomedical Applications, Telemedicine
Biometrics and Bioinformatics
Wireless communication
Ad Hoc and Sensor Networks
Cyber Security
Signal/Image and Video Processing
Reconfigurable and Embedded Systems
Software Engineering and Middleware Architecture
Electronic Design Automation
Intelligent and Multi-agent Control Systems
Distributed Data Fusion and Mining
Important Dates:
Submission of full papers (in PDF form): January, 2010 Notification of acceptance: February, 2010 Final manuscript (in PDF form): March, 2010 Author registration deadline: April, 2010
15th International Symposium on Electromagnetic Launch Technology
(EML2010)
RoyalMilitaryAcademy Brussels, Belgium
17 May - 20 May, 2010
Conference Scope:
The EML Symposium is a biennial event that serves as the principal forum for the discussion, interchange, and presentation of research on critical technologies for accelerating macroscopic objects or projectiles to hypervelocities using electromagnetic or electrothermochemical launchers. The EML Symposia have a long-standing international reputation as a catalyst for stimulating research in the eld of electromagnetic launch. During the Symposium, researchers share and exchange a wealth of knowledge through
